Dicitak Circuit Board mangrupakeun cornerstone produk éléktronik, éta pohara penting pikeun produk Anjeun bisa ngajalankeun stably pikeun lila atanapi henteu.Salaku PCB profésional sarta produsén Majelis PCB, PCBFuture nempatkeun hiji nilai luhur dina kualitas papan circuit.
PCBFuture mimitian ti bisnis fabrikasi PCB, teras ngalegaan ka assembly PCB sareng komponenana sourcing jasa, ayeuna geus jadi salah sahiji pangalusna produsén assembly turnkey PCB.Urang nyieun loba usaha pikeun investasi dina equipments canggih pikeun téhnologi hadé, sistem internal dioptimalkeun pikeun efisiensi hadé, empower kuli pikeun kaahlian hadé.
| Prosés | Barang | Kamampuh Prosés | |
| Émbaran Dasar | Kamampuhan Produksi | Jumlah lapisan | 1-30 lapisan |
| Ruku jeung pulas | 0,75% baku, 0,5% maju | ||
| Min.ukuran PCB rengse | 10 x 10 mm (0,4 x 0,4 ") | ||
| Max.ukuran PCB rengse | 530 x 1000mm(20,9 x 47,24 ") | ||
| Multi-pencét pikeun buta / vias dikubur | Multi-pencét Cycle≤3 kali | ||
| ketebalan dewan rengse | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Réngsé kasabaran ketebalan dewan | +/- 10% baku, +/- 0.1mm maju | ||
| Beungeut bérés | HASL, HASL bébas kalungguhan, Flash emas, ENIG, Plating emas teuas, OSP, Immersion Tin, Immersion pérak, jsb | ||
| Selektif permukaan finish | ENIG+Ramo emas, Emas kilat+Ramo emas | ||
| Jenis Bahan | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide / Poliéster, jsb. | Ogé bisa meuli bahan sakumaha pamundut | |
| Foil tambaga | 1/3 oz ~ 10 oz | ||
| Jenis Prepreg | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, jsb. | |
| Uji anu dipercaya | Kakuatan mesek | 7,8N/cm | |
| Kamampuhan | 94V-0 | ||
| Kontaminasi ionik | ≤1ug/cm² | ||
| Min.ketebalan diéléktrik | 0,075 mm (3 mil) | ||
| kasabaran impedansi | +/- 10%, mnt tiasa ngontrol +/- 7% | ||
| Lapisan jero & Lapisan Luar Transfer Gambar | Kamampuhan Mesin | Mesin Scrubbing | ketebalan bahan: 0.11 ~ 3.2mm (4.33mil ~ 126mil) |
| Ukuran bahan: min.228 x 228 mm (9 x 9") | |||
| Laminator, Exposer | Ketebalan bahan: 0.11 ~ 6.0mm (4.33 ~ 236mil) | ||
| Ukuran bahan: min 203 x 203mm (8 x 8"), maksimal 609,6 x 1200mm (24 x 30 ") | |||
| Garis Etching | ketebalan bahan: 0.11 ~ 6.0mm (4.33mil ~ 236mil) | ||
| Ukuran bahan: min.177 x 177 mm (7 x 7") | |||
| Lapisan jero Kamampuh Prosés | Min.lebar garis jero / spasi | 0,075/0,075mm (3/3mil) | |
| Min.jarak ti ujung liang ka conductive | 0,2 mm (8 mil) | ||
| Min.ring annular lapisan jero | 0,1 mm (4 mil) | ||
| Min.bersihan isolasi lapisan dalam | 0.25mm (10mil) baku, 0.2mm (8mil) maju | ||
| Min.jarak ti ujung dewan ka conductive | 0,2 mm (8 mil) | ||
| Min.lebar gap antara taneuh tambaga | 0,127 mm (5 mil) | ||
| Kasaimbangan ketebalan tambaga pikeun inti jero | H/1oz, 1/2oz | ||
| Max.ketebalan tambaga rengse | 10oz | ||
| Lapisan luar Kamampuh Prosés | Min.lebar garis luar / spasi | 0,075/0,075mm (3/3mil) | |
| Min.ukuran pad liang | 0,3 mm (12 mil) | ||
| Kamampuh Prosés | Max.ukuran tenting slot | 5 x 3 mm (196,8 x 118 mil) | |
| Max.ukuran liang tenting | 4.5mm (177.2mil) | ||
| Min.tent lebar taneuh | 0,2 mm (8 mil) | ||
| Min.cingcin annular | 0,1 mm (4 mil) | ||
| Min.BGA pitch | 0,5 mm (20 mil) | ||
| AOI | Kamampuhan Mesin | Orbotech SK-75 AOI | Ketebalan bahan: 0.05 ~ 6.0mm (2 ~ 236.2mil) |
| Ukuran bahan: max.597 ~ 597mm(23,5 x 23,5") | |||
| Orbotech Ves Mesin | Ketebalan bahan: 0.05 ~ 6.0mm (2 ~ 236.2mil) | ||
| Ukuran bahan: max.597 ~ 597mm(23,5 x 23,5") | |||
| Pangeboran | Kamampuhan Mesin | Mesin bor MT-CNC2600 | Ketebalan bahan: 0.11 ~ 6.0mm (4.33 ~ 236mil) |
| Ukuran bahan: max.470 ~ 660mm(18,5 x 26") | |||
| Min.Ukuran bor: 0.2mm (8mil) | |||
| Kamampuh Prosés | Min.multi-pencét ukuran bor bit | 0.55mm (21.6mil) | |
| Max.rasio aspék (ukuran dewan rengse VS ukuran bor) | 12:01 | ||
| Toleransi lokasi liang (dibandingkeun sareng CAD) | +/- 3 jt | ||
| Counterbore liang | PTH&NPTH, Sudut luhur 130°, Diaméter luhur <6.3mm | ||
| Min.jarak ti ujung liang ka conductive | 0,2 mm (8 mil) | ||
| Max.ukuran bor bit | 6.5mm (256mil) | ||
| Min.ukuran slot multi-pencét | 0.45mm (17.7mil) | ||
| kasabaran ukuran liang pikeun pencét fit | +/- 0,05 mm (+/- 2 mil) | ||
| Min.kasabaran ukuran slot PTH | +/- 0,15 mm (+/- 6 mil) | ||
| Min.kasabaran ukuran slot NPTH | +/-2mm (+/- 78,7 mil) | ||
| Min.jarak ti ujung liang ka conductive (vias buta) | 0,23 mm (9 mil) | ||
| Min.ukuran bor laser | 0.1mm (+/-4mil) | ||
| Countersink sudut liang & Diaméterna | Puncak 82,90,120 ° | ||
| Prosés baseuh | Kamampuhan Mesin | Panel & Pola garis plating | Ketebalan bahan: 0.2 ~ 7.0mm (8 ~ 276mil) |
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Deburring Maching | Ketebalan bahan: 0.2 ~ 7.0mm (8 ~ 276mil) | ||
| Ukuran bahan: min.203 x 203 mm(8" x 8") | |||
| Jalur Desmear | ketebalan bahan: 0.2mm ~ 7.0mm (8 ~ 276mil) | ||
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Timah plating garis | Ketebalan bahan: 0.2 ~ 3.2mm (8 ~ 126mil) | ||
| Ukuran bahan: max.610 x 762 mm (24 x 30") | |||
| Kamampuh Prosés | Ketebalan tambaga témbok liang | rata 25um (1mil) baku | |
| Réngsé ketebalan tambaga | ≥18um (0.7mil) | ||
| Min lebar garis pikeun etching nyirian | 0,2 mm (8 mil) | ||
| beurat tambaga Max.finished pikeun lapisan jero & luar | 7oz | ||
| ketebalan tambaga béda | H / 1 oz, 1/2 oz | ||
| Topeng Solder & Silkscreen | Kamampuhan Mesin | Mesin Scrubbing | ketebalan bahan: 0.5 ~ 7.0mm (20 ~ 276mil) |
| Ukuran bahan: min.228 x 228 mm (9 x 9") | |||
| Exposer | Ketebalan bahan: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Ukuran bahan: max.635 x 813 mm (25 x 32") | |||
| Ngembangkeun mesin | Ketebalan bahan: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Ukuran bahan: min.101 x 127 mm (4 x 5") | |||
| Warna | Warna topeng solder | Héjo, matte héjo, konéng, hideung, biru, beureum, bodas | |
| Warna layar sutra | Bodas, koneng, hideung, biru | ||
| Kamampuh Topeng Solder | Min.bubuka topeng solder | 0,05 mm (2 mil) | |
| Max.plugged ngaliwatan ukuran | 0,65mm (25,6mil) | ||
| Min.lebar pikeun sinyalna garis ku S/M | 0,05 mm (2 mil) | ||
| Min.solder topeng Kujang lebar | 0.2mm (8mil) baku, 0.17mm (7mil) maju | ||
| Min.ketebalan topeng solder | 10um (0,4 mil) | ||
| ketebalan topeng Solder pikeun via tenting | 10um (0,4 mil) | ||
| Min.lebar garis minyak karbon / spasi | 0.25/0.35mm (10/14mil) | ||
| Min.palacak karbon | 0.06mm (2.5mil) | ||
| Min.jejak garis minyak karbon | 0,3 mm (12 mil) | ||
| Min.jarak ti pola karbon ka bantalan | 0,25 mm (10 mil) | ||
| Min.lebar pikeun garis panutup topeng peelable / Pad | 0,15 mm (6 mil) | ||
| Min.lebar sasak topeng solder | 0,1 mm (4 mil) | ||
| Solder topeng Teu karasa | 6H | ||
| Kamampuhan Topeng Peelable | Min.jarak ti pola topeng peelable ka pad | 0,3 mm (12 mil) | |
| Max.ukuran pikeun liang tenda topeng peelable (Ku percetakan layar) | 2mm (7,8 mil) | ||
| Max.ukuran pikeun liang tenda topeng peelable (Ku percetakan aluminium) | 4,5 mm | ||
| Ketebalan topeng peelable | 0,2 ~ 0,5mm (8 ~ 20mil) | ||
| Kamampuhan Silkscreen | Min.lebar garis silkscreen | 0.11mm (4.5mil) | |
| Min.jangkungna garis silkscreen | 0,58 mm (23 mil) | ||
| Min.jarak ti legenda ka Pad | 0,17 mm (7 mil) | ||
| Surface Finish | Kamampuh Finish Surface | Max.panjang ramo emas | 50mm (2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nikel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) emas | ||
| ramo emas | 3 ~ 5um (0.11 ~ 197mil) nikel, 0.25 ~ 1.5um (0.01 ~ 0.059mil) emas | ||
| HASL | 0,4um(0,016mil) Sn/Pb | ||
| Mesin HASL | ketebalan bahan: 0.6 ~ 4.0mm (23.6 ~ 157mil) | ||
| Ukuran bahan: 127 x 127mm ~ 508 x 635mm (5 x 5" ~ 20 x 25") | |||
| Plating emas teuas | 1-5u" | ||
| Immersion Tin | 0,8 ~ 1,5um (0,03 ~ 0,059mil) Tin | ||
| Immersion Silver | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| E-Tés | Kamampuhan Mesin | Ngalayang usik tester | Ketebalan bahan: 0.4 ~ 6.0mm (15.7 ~ 236mil) |
| Ukuran bahan: max.498 x 597mm(19.6 ~ 23.5") | |||
| Min.jarak ti test pad ka ujung dewan | 0,5 mm (20 mil) | ||
| Min.lalawanan conductive | 5Ω | ||
| Max.lalawanan insulasi | 250mΩ | ||
| Max.tegangan tés | 500V | ||
| Min.ukuran pad test | 0,15 mm (6 mil)) | ||
| Min.test pad ka pad spasi | 0,25 mm (10 mil) | ||
| Max.tés ayeuna | 200mA | ||
| Profiling | Kamampuhan Mesin | Jenis profiling | NC routing, V-cut, tab slot, liang cap |
| NC routing mesin | Ketebalan bahan: 0.05 ~ 7.0mm (2 ~ 276mil) | ||
| Ukuran bahan: max.546 x 648 mm (21,5 x 25,5") | |||
| mesin V-cut | Ketebalan bahan: 0.6 ~ 3.0mm (23.6 ~ 118mil) | ||
| Lebar bahan maksimum pikeun V-cut: 457mm (18 ") | |||
| Kamampuh Prosés | Min.ukuran bit routing | 0.6mm (23.6mil) | |
| Min.outline toleransi | +/- 0,1 mm (+/- 4 mil) | ||
| Tipe sudut V-cut | 20°, 30°, 45°, 60° | ||
| V-cut kasabaran sudut | +/-5° | ||
| V-cut kasabaran pendaptaran | +/- 0,1 mm (+/- 4 mil) | ||
| Min.jarak ramo emas | +/- 0,15 mm (+/- 6 mil) | ||
| Bevelling sudut kasabaran | +/-5° | ||
| Bevelling tetep kasabaran ketebalan | +/- 0,127mm (+/-5mil) | ||
| Min.radius jero | 0.4mm (15.7mil) | ||
| Min.jarak ti conductive ka outline | 0,2 mm (8 mil) | ||
| Countersink / Counterbore kasabaran jero | +/- 0,1 mm (+/- 4 mil) | ||